Overview

• DPM-219E Resin is an epoxy-modified polysiloxane resin characterized by a high silicon content and high molecular weight. It contains a high concentration of active ingredients, low VOCs, and minimal odor; it is free from isocyanates, non-toxic, and cures at room temperature, offering excellent corrosion resistance and weather resistance.

Typical Characteristic

item	unit	data
appearance	/	Colorless to pale yellow liquid
Solid content	%	84±2
viscosity	CPS	1000-2000
epoxide equivalent	g/eq	2000-3400
specific gravity	/	1.00-1.20

Product Features

• Solvent-free, high solid content, low odor
• Excellent resistance to acids, alkalis, corrosion, and weathering
• Can be cured at room temperature

Application Area

• Corrosion protection coating
• High-temperature resistant coatings
• As a resin modifier, silicone components can be introduced into other resins.
• Note: The recommended curing agents are DPM-802 or DPM-803; the recommended mixing ratio is 5:1 (resin to curing agent). This product can be cured in the presence of moisture; it is sensitive to moisture and alkaline substances. During use, avoid employing solvents, pigments, fillers, or other materials with high water content. During the manufacturing process, try to avoid high-humidity environments and minimize the product’s exposure to air.

Safety, Packaging and Storage

• Store in a dry, cool, and ventilated location at a temperature ranging from-5°C to 40°C; avoid direct sunlight and store in a tightly sealed container. When stored in the original packaging, the shelf life is 12 months; prevent contamination by acids or alkalis, and keep away from open flames and heat sources.
• 2、25 kg or 200 kg packaging

Packaging Images

Price

Disclaimer：The above information is provided based on the specific characteristics of our products and is derived from existing knowledge; it is intended solely as an introduction and usage recommendation for our products and does not constitute a warranty regarding the specific characteristics of our products when used in particular applications. Therefore, we assume no responsibility for this information or recommendations.