DPM-2110E  Siloxane resin

Overview

• DPM-2110E Resin is an epoxy-modified polysiloxane resin. It is solvent-free, low-viscosity, low-VOC, and low-smell; it cures at room temperature, is heat-resistant, possesses certain flame retardancy, and exhibits excellent corrosion resistance and weather resistance.

Typical Characteristic

item	unit	data
appearance	/	Colorless to pale yellow liquid
Solid content	%	96±2
viscosity	CPS	100-500
epoxide equivalent	g/eq	320-370
specific gravity	/	1.00-1.20

Product Features

• Solvent-free, low viscosity, low odor
• Excellent resistance to acids, alkalis, and weathering
• High-temperature resistance and excellent flame retardancy
• Can be cured at room temperature

Application Area

• Corrosion Protection and Engineering Protection Coatings
• High-temperature resistant coatings and thermal-resistant coatings
• Specialty industrial floor coating
• Note: The recommended curing agent is DPM-801; the recommended mixing ratio is 1:1 (resin to curing agent). This product can be cured in the presence of moisture; it is sensitive to moisture and alkaline substances. During use, avoid employing solvents, pigments, fillers, or other materials with high water content. During the manufacturing process, try to avoid high-humidity environments and minimize the product’s exposure to air

Safety, Packaging and Storage

• Store the product in a dry, cool, and well-ventilated location at a temperature ranging from –5°C to 40°C; avoid direct sunlight and store it in a sealed container. When stored in the original packaging, the shelf life is 12 months. Prevent contamination by acids or alkalis, and keep away from open flames and heat sources.2、25 kg or 200 kg packaging

Packaging Images

Price

Disclaimer：The above information is provided based on the specific characteristics of our products and is derived from existing knowledge; it is intended solely as an introduction and usage recommendation for our products and does not constitute a warranty regarding the specific characteristics of our products when used in particular applications. Therefore, we assume no responsibility for this information or recommendations.